Insights
Notes from the floor
Technical writing about the parts of manufacturing that decide whether a board survives — inspection, design for manufacture, materials handling. Written by the people who do it, not a content team.
Why we X-ray every BGA, not a sample
A ball grid array hides hundreds of joints beneath the package, where no optical inspection can reach. Sampling them tells you about the sample. Here is why we image every one.
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What a DFM review actually catches
Almost every respin we see was avoidable, and almost all of them were visible in the design file. These are the six classes of problem a manufacturability review finds before the first board is built.
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Moisture-sensitive devices, and why floor life decides the reflow
A perfectly designed board, placed perfectly, can still fail at reflow because of something that happened to a component weeks earlier in a stockroom. Moisture is the reason.
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