Contract electronic manufacturing · Lisburn
Fine-pitch SMT assembly
Two fully automated surface-mount lines put every part down exactly where the design intends. Fine-pitch to 0201, micro-BGA and press-fit back and mid-planes, all fed from temperature- and humidity-controlled component storage.
What we do
- Fine-pitch surface-mount assembly down to 0402 and 0201 passives
- Micro-BGA and fine-pitch IC placement
- Solder-print, reflow and quality control at the oven steps
- Water-wash processing and full RoHS-compliant lead-free reflow
- Press-fit backplane and midplane assembly
- Full through-hole alongside SMT: selective, wave and hand soldering
The detail
- Line configuration
- Feeder → solder print → 4× Universal Fusion → reflow QC → extractor
- Placement
- Fine-pitch to 0201 · micro-BGA · press-fit
- Inspection
- Multiple standalone AOI stations · 5-axis real-time X-ray
- Test
- In-circuit and functional test before despatch
- Materials
- Temperature- and humidity-controlled storage · MSD dry storage, bake-out and floor-life tracking · ESD-safe throughout
- Compliance
- ISO 9001 · IPC-A-610 class workmanship · RoHS & REACH
Why the line matters more than the quote
A fine-pitch board is only as repeatable as the process that builds it. Prototypes run on the same qualified line as volume, with process parameters logged at every stage and full traceability from goods-in to despatch. Scaling up does not mean re-qualifying, and a problem two years from now can still be traced back to the reel the part came from.
Tell us what you're building.
You'll get honest engineering input and a clear route to production. Your design and IP stay confidential, and we'll put an NDA in place before you share anything. We reply within one working day.