Contract electronic manufacturing · Lisburn
BGA placement, rework & reball
Precision BGA and micro-BGA placement, plus complete rework and reball capability. We recover high-value assemblies that others write off, and every result is verified under 5-axis real-time X-ray.
What we do
- BGA and micro-BGA placement on automated fine-pitch lines
- Full BGA rework: controlled removal, site preparation and replacement
- Reball of recovered devices
- Recovery of high-value assemblies rather than scrapping the board
- Post-rework verification under 5-axis real-time X-ray
- Moisture-sensitive device handling: dry storage, bake-out and floor-life tracking before any reflow
The detail
- Devices
- BGA · micro-BGA · fine-pitch packages
- Operations
- Placement · rework · reball · high-value recovery
- Verification
- 5-axis real-time X-ray on every ball array: voids, bridges and opens
- MSD control
- Dry storage, bake-out and floor-life tracking
- Evidence
- Full process traceability on the inspection result
- Compliance
- ISO 9001 · IPC-A-610 class workmanship
What sits under the package
A ball grid array hides hundreds of joints beneath the package, where no optical inspection can reach. Rework without X-ray verification produces a board that looks fine and may not be. Every BGA we place or rework is imaged rather than sampled, and the result is recorded against the build.
Tell us what you're building.
You'll get honest engineering input and a clear route to production. Your design and IP stay confidential, and we'll put an NDA in place before you share anything. We reply within one working day.