Contract electronic manufacturing · Lisburn
BGA placement, rework & reball
Precision BGA and micro-BGA placement, plus complete rework and reball capability — recovering high-value assemblies that others write off, with every result verified under 5-axis real-time X-ray.
What we do
- BGA and micro-BGA placement on automated fine-pitch lines
- Full BGA rework — controlled removal, site preparation and replacement
- Reball of recovered devices
- Recovery of high-value assemblies rather than scrapping the board
- Post-rework verification under 5-axis real-time X-ray
- Moisture-sensitive device handling — dry storage, bake-out and floor-life tracking before any reflow
The detail
- Devices
- BGA · micro-BGA · fine-pitch packages
- Operations
- Placement · rework · reball · high-value recovery
- Verification
- 5-axis real-time X-ray — voids, bridges and opens on every ball array
- MSD control
- Dry storage, bake-out and floor-life tracking
- Evidence
- Full process traceability on the inspection result
- Compliance
- ISO 9001 · IPC-A-610 class workmanship
A hidden joint is either proven or assumed
A ball grid array hides hundreds of joints beneath the package, where no optical inspection can reach. Rework without X-ray verification produces a board that looks fine and may not be. Every BGA we place or rework is imaged — not a sampled subset — and the result is recorded against the build.
Tell us what you're building.
You'll get honest engineering input and a clear route to production. Your design and IP stay confidential — we'll put an NDA in place before you share anything. We reply within one working day.