Board
6-layer control PCB
An example review — so you know what you'll get.
A redacted sample of the review every customer receives. We flag the manufacturability and reliability risks in your design — honestly and free. Getting them right, and building boards that can't fail, is what we do together.
| Severity | Area | What we found & why it matters |
|---|---|---|
| Risk | Solder & thermal | Ground pour on U7 has no thermal relief on two pads. → Cold-joint & tombstoning risk at reflow — resolved with you before build. |
| Risk | DFM / spacing | A cluster of 0201s sits below our courtyard process window. → Solder-bridging risk in volume — corrected together at DFM. |
| Advisory | Testability | Four critical nets have no test access. → Limits in-circuit & functional coverage — test strategy defined with you. |
| Sourcing | Obsolescence | Two components are nearing end-of-life with extended lead times. → Supply risk — qualified alternates sourced through our 1,000+ distributor network when we build. |
| Handling | Moisture sensitivity | One MSL-3 device identified. → Dry-stored, baked and floor-life tracked in our controlled component storage — no popcorning risk at reflow. |
| Planned | Inspection | All 8 BGAs have hidden joints under the package. → 100% 5-axis real-time X-ray scheduled — every ball and void verified, not assumed. |