Board
6-layer control PCB
An example review, so you know what you'll get.
A redacted sample of the review every customer receives. We flag the manufacturability and reliability risks in your design, honestly and free. Getting them right, and building boards that can't fail, is what we do together.
| Severity | Area | What we found & why it matters |
|---|---|---|
| Risk | Solder & thermal | Ground pour on U7 has no thermal relief on two pads. → Cold-joint & tombstoning risk at reflow, resolved with you before build. |
| Risk | DFM / spacing | A cluster of 0201s sits below our courtyard process window. → Solder-bridging risk in volume, corrected together at DFM. |
| Advisory | Testability | Four critical nets have no test access. → Limits in-circuit & functional coverage, so the test strategy is defined with you. |
| Sourcing | Obsolescence | Two components are nearing end-of-life with extended lead times. → Supply risk, so qualified alternates are sourced through our 1,000+ distributor network when we build. |
| Handling | Moisture sensitivity | One MSL-3 device identified. → Dry-stored, baked and floor-life tracked in our controlled component storage, so there is no popcorning risk at reflow. |
| Planned | Inspection | All 8 BGAs have hidden joints under the package. → 100% 5-axis real-time X-ray scheduled, so every ball and void is verified rather than assumed. |